Making a difference for our customers
laser envent

Sales Email:

Blog blog
Location:Home > Blog > Can brittle and hard ceramics be processed by laser

How do I determine the optimal laser parameters for my material? Finding the right laser parameters is a must for achieving the best possible laser cutting and laser engraving results.

Can brittle and hard ceramics be processed by laser

Release Time:2022/04/28 Blog Browsing Times:56

Ceramic is a widely used inorganic non-metallic material at present. It has the advantages of high durability, high hardness, high melting point and oxidation resistance. At the same time, ceramic has good insulation performance and special electromagnetic properties. It has great application value in modern digital communication and telecommunications information equipment. It is a common material in the fields of high-end PCB, electronic communication, aerospace and so on.

On the other hand, ceramics are highly brittle materials, which are basically non plastic after forming. They are easy to break when subjected to strong external mechanical forces and stress changes, and their strength is greatly reduced after crushing. Unlike metal damage and deformation, they can retain a certain material strength and have small buffer space. Therefore, special technologies need to be used when dealing with ceramic precision processing.

CO2 laser marking machine

Obviously, the processing range of hard materials needs to be well controlled, which is not only limited by the traditional processing method, but also needs a lot of processing space.

As a non-contact processing, laser technology has unique advantages in the application of ceramic materials. The first is that the processing process will not cause mechanical extrusion or stress to ceramics, which is safe and reliable; Secondly, laser processing is efficient, accurate and easy to control. With the laser control system, complex patterns or micropores can be processed on ceramics.

Of course, laser processing of ceramics also requires corresponding equipment and processes. Taking marking as an example, UV laser marking equipment is generally used for laser marking of ceramic materials – UV laser processing mainly realizes material removal and evaporation by breaking the chemical molecular bonds of materials, so UV excitation is also known as “cold” processing. In addition to the non-contact of laser processing, this method avoids thermal reaction, which is safe and efficient.

At present, laser processing of ceramics is mainly cutting, drilling, marking and other processes, and the thickness should not be too high. High thickness ceramic processing has other methods such as precision machining, and laser is not the optimal solution.

In a word, as a flexible automatic processing method, laser has unique advantages in the processing of ceramic materials. At the same time, with the cooperation of precision processing, the natural advantages of ceramic materials play more and more excellent performance. The combination of the two promotes each other and develops together, which is a good thing loved by industrial production.